The realization of low-dislocation-density bulk GaN crystals is
necessary for use in the fabrication of future high-power devices with low
power consumption. In this study, we attempted the regrowth of
low-dislocation-density (104–105 cm−2) GaN substrates to fabricate thick
and low-dislocation-density GaN crystals using the dipping technique with the
Na-flux method. In the growth using this dipping technique, the generation of
dislocations at the interface between the GaN substrate and the regrowth layer
was prevented, and we succeeded in fabricating thick and
low-dislocation-density GaN crystals. In the growth without the dipping
technique, the surface of the GaN substrate demonstrated meltback immediately
before the growth, and dislocations were newly generated. These results
indicate that the Na-flux dipping technique has potential use for the
fabrication of low-dislocation-density bulk GaN crystals.
Source:IOPscience
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